Associate Researchers


XIE Quancai

Academic Title

Assistant Professor

Research field

Strong motion Seismology

Phone

+86-15945196920

Fax

E-mail

xiequancai@iem.ac.cn

Address

29 Xuefu Road, Harbin 150080, China

Education

Ph.D.

Disaster Prevention and Reduction Engineering and Protective Engineering, Institute of Engineering Mechanics(IEM), China Earthquake Administration(CEA), 2018

M.

Disaster Management Policy, National Graduate Institute for Policy Studies(GRIPS) &Building Research Institute(BRI),Japan,2013

M.E.

Disaster Prevention and Reduction Engineering and Protective Engineering, Institute of Engineering Mechanics(IEM), China Earthquake Administration(CEA), 2009

B.E.

Computer Science and Technology, Shandong University,Weihai, 2006

Professional Experience

2012.12-present

Assistant Professor, Institute of Engineering Mechanics, CEA

2009.07-2012.12

Practice Research Fellow, Institute of Engineering Mechanics, CEA

Research Interest

Strong motion observation, Strong motion data processing.

Seismic site effect, Fault slip inversion.

Supported Projects

1 Strong motion observation technology and application of Tangshan borehole array. Fundamental Research Grant of Institute of Engineering Mechanics, China Earthquake Administration (2014B02), PI, 2014.6-2017.12.


Selected Publications

1

Xie Quancai, Lv Gaohu, Chen Hao, Xu Chong, Feng Biao. Seismic damage to road networks subjected to earthquakes in Nepal, 2015. Earthquake Engineering and Engineering Vibration, 2017, 16(3): 649-670.

 

2

Xie Quancai, Ma Qiang, Wang Liyan, Zhang Jingfa. Strong motion data process and analysis of 2017 Jiuzhaigou 7.0 Earthquake. Earthquake Engineering and Engineering Dynamics, 2018, 38(5):111-119(in Chinese).

 

3

Xie Quancai, Ma Qiang, Yang Cheng. A review of study on strong motion database [J].Earthquake Engineering and Engineering Dynamics, 2017, 37(3): 48-56(in Chinese).

 

4

Xie Quancai, Yang Cheng. Study on data and technology of the strong motion data share sub-center. Proceedings of the 16th World Conference on Earthquake Engineering, Santiago, Chile, 2017, Paper No. 3153.